Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures

Abstract

A millimeter-wave substrate integrated waveguide (SIW) has been demonstrated using micromachined tungsten-coated through glass silicon via (TGSV) structures. Two-step deep reactive ion etching (DRIE) of silicon vias and selective tungsten coating onto them using a shadow mask are combined with glass reflow techniques to realize a glass substrate with metal-coated TGSVs for millimeter-wave applications. The proposed metal-coated TGSV structures effectively replace the metallic vias in conventional through glass via (TGV) substrates, in which an additional individual glass machining process to form micro holes in the glass substrate as well as a time-consuming metal-filling process are required. This metal-coated TGSV substrate is applied to fabricate a SIW operating at Ka-band as a test vehicle. The fabricated SIW shows an average insertion loss of 0.69 ± 0.18 dB and a return loss better than 10 dB in a frequency range from 20 GHz to 45 GHz.

Keywords

• substrate integrated waveguide (SIW)
• tungsten-coated through glass silicon via (TGVS)
• through glass via (TGV)
• glass reflow