Thermal Conductivity Gas Sensors for High-Temperature Applications
Nikolay Samotaev,
Boris Podlepetsky,
Mikhail Mashinin,
Igor Ivanov,
Ivan Obraztsov,
Konstantin Oblov,
Pavel Dzhumaev
Affiliations
Nikolay Samotaev
Institute of Nanoengineering in Electronics, Spintronics and Photonics, National Research Nuclear University MEPhI (Moscow Engineering Physics Institute), Kashirskoe Highway 31, 115409 Moscow, Russia
Boris Podlepetsky
Institute of Nanoengineering in Electronics, Spintronics and Photonics, National Research Nuclear University MEPhI (Moscow Engineering Physics Institute), Kashirskoe Highway 31, 115409 Moscow, Russia
Mikhail Mashinin
Institute of Nanoengineering in Electronics, Spintronics and Photonics, National Research Nuclear University MEPhI (Moscow Engineering Physics Institute), Kashirskoe Highway 31, 115409 Moscow, Russia
Igor Ivanov
Institute of Nanoengineering in Electronics, Spintronics and Photonics, National Research Nuclear University MEPhI (Moscow Engineering Physics Institute), Kashirskoe Highway 31, 115409 Moscow, Russia
Ivan Obraztsov
Institute of Nanoengineering in Electronics, Spintronics and Photonics, National Research Nuclear University MEPhI (Moscow Engineering Physics Institute), Kashirskoe Highway 31, 115409 Moscow, Russia
Konstantin Oblov
Institute of Nanoengineering in Electronics, Spintronics and Photonics, National Research Nuclear University MEPhI (Moscow Engineering Physics Institute), Kashirskoe Highway 31, 115409 Moscow, Russia
Pavel Dzhumaev
Institute of Nanoengineering in Electronics, Spintronics and Photonics, National Research Nuclear University MEPhI (Moscow Engineering Physics Institute), Kashirskoe Highway 31, 115409 Moscow, Russia
This paper describes a fast and flexible microfabrication method for thermal conductivity gas sensors useful in high-temperature applications. The key parts of the sensor, the microheater and the package, were fabricated from glass-coated platinum wire and the combination of laser micromilling (ablation) of already-sintered monolithic ceramic materials and thick-film screen-printing technologies. The final thermal conductivity gas sensor was fabricated in the form of a complete MEMS device in a metal ceramic package, which could be used as a compact miniaturized surface-mounted device for soldering to standard PCB. Functional test results of the manufactured sensor are presented, demonstrating their full suitability for gas sensing applications and indicating that the obtained parameters are at a level comparable to those of standard industrially produced sensors. The results of the design and optimization principles of applied methods are discussed with regard to possible wider applications in thermal gas sensor prototyping in the future. The advantage of the developed sensors is their ability to operate in air environments under high temperatures of 900 °C and above. The sensor element material and package metallization were insensitive to oxidation compared with classical sensor-solution-based metal–glass packages and silicone MEMS membranes, which exhibit mechanical stress at temperatures above 700 °C.