Diamond grinding quality analysis based on controlled grinding depth

Abstract

In order to explore the surface grinding quality and subsurface damage law of the grinding depth on the diamond material, the model of diamond workpiece ground by multi grits is established by molecular dynamics (MD) method. The effect of different grinding depths on the grinding force, the grinding quality of the surface and the subsurface damage characteristics of the material is studied. The analysis shows that the chip atoms accumulated between the grits have the effect of micro-grinding, and that the amorphous area between the grits is gradually fused together under the action of grinding to form the processing surface of the diamond material. The grinding depths of h = 0.36 nm, 0.71 nm, 1.07 nm and 1.43 nm are used respectively. The springback of diamond crystal material can be effectively inhibited only when the grinding depth exceeds 0.71 nm. However, increasing the grinding depth will increase the accumulation of atoms on the surface of diamond workpiece, which cannot improve the grinding quality. At the same time, the increase of the grinding depth will intensify the subsurface damage to the diamond workpiece. The subsurface damage of the material with a grinding depth below 0.71 nm is small and stable. However, the damage increases rapidly when the grinding depth exceeds 0.71 nm and large-depth damage over 3 nm appears on the subsurface.

Keywords

• molecular dynamics
• diamond
• grinding depth
• subsurface damage