Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

Liang Zhang; Liang Zhang; Su-Juan Zhong

doi:10.3389/fmats.2021.645782

Frontiers in Materials (May 2021)

Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

Liang Zhang,
Liang Zhang,
Su-Juan Zhong

Affiliations

Liang Zhang: Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou, China
Liang Zhang: School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, China
Su-Juan Zhong: Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou, China

DOI: https://doi.org/10.3389/fmats.2021.645782
Journal volume & issue: Vol. 8

Abstract

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In this article, the 3D integration with Ni/Sn/Ni joints was conducted using transient liquid phase (TLP) bonding (250°C, 0.2 N) with different bonding time. After TLP bonding, plane-type Ni3Sn4 intermetallic compound (IMC) was observed, and when the bonding time is 180 min, complete Ni3Sn4 was found. The diffusion coefficient D was determined to be 32.4 μm2/min. Based on the finite element (FE) simulation, the results demonstrated that the shear stress and equivalent creep strain increased obviously with an increase in the IMC thickness; the results calculated show that the IMC thickness impacts the fatigue life of solder joints significantly, and the fatigue life decreases notably with an increase in the Ni3Sn4 thickness.

Published in Frontiers in Materials

ISSN: 2296-8016 (Online)
Publisher: Frontiers Media S.A.
Country of publisher: Switzerland
LCC subjects: Technology
Website: https://www.frontiersin.org/journals/materials

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