Innovative Stacked Yellow and Blue Mini-LED Chip for White Lamp Applications
Tzu-Yi Lee,
Chien-Chi Huang,
Wen-Chien Miao,
Fu-He Hsiao,
Chia-Hung Tsai,
Yu-Ying Hung,
Fang-Chung Chen,
Chun-Liang Lin,
Kazuhiro Ohkawa,
Jr-Hau He,
Yu-Heng Hong,
Hao-Chung Kuo
Affiliations
Tzu-Yi Lee
Department of Photonics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan
Chien-Chi Huang
Department of Photonics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan
Wen-Chien Miao
Semiconductor Research Center, Foxconn Research, Taipei 11492, Taiwan
Fu-He Hsiao
Semiconductor Research Center, Foxconn Research, Taipei 11492, Taiwan
Chia-Hung Tsai
Department of Photonics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan
Yu-Ying Hung
Department of Photonics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan
Fang-Chung Chen
Department of Photonics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan
Chun-Liang Lin
Department of Electrophysics, College of Science, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan
Kazuhiro Ohkawa
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia
Jr-Hau He
Department of Materials Science and Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong, China
Yu-Heng Hong
Semiconductor Research Center, Foxconn Research, Taipei 11492, Taiwan
Hao-Chung Kuo
Department of Photonics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan
This study introduces a novel approach for fabricating vertically stacked mini-LED arrays, integrating InGaN yellow and blue epitaxial layers with a stress buffer layer to enhance optoelectronic characteristics and structural stability. This method significantly simplifies the LED design by reducing the need for RGB configurations, thus lowering costs and system complexity. Employing vertical stacking integration technology, the design achieves high-density, efficient white light production suitable for multifunctional applications, including automotive lighting and outdoor signage. Experimental results demonstrate the exceptional performance of the stacked yellow and blue mini-LEDs in terms of luminous efficiency, wavelength precision, and thermal stability. The study also explores the performance of these LEDs under varying temperature conditions and their long-term reliability, indicating that InGaN-based yellow LEDs offer superior performance over traditional AlGaInP yellow LEDs, particularly in high-temperature environments. This technology promises significant advancements in the design and application of lighting systems, with potential implications for both automotive and general illumination markets.
