Micron Ti metal particles were incorporated into SiCp/7075Al composites using pressure infiltration. The interface structure between the Ti metal particles and the matrix during the casting processes were investigated. Results show that the dispersed unreacted Ti particles form mutual diffusion layer at the interface without the formation of low-temperature intermetallic phases during the solidification processes. The interaction between the micron Ti and the molten aluminum alloy is subject to the mutual diffusion coefficient of Ti−Al rather than the reaction activation energy. The tensile strength and plasticity of the composite were improved simultaneously due to the high interfacial bonding strength and released thermal misfit stress cause by the incorporated Ti metal particles.
