Sputter grown CuO thin films: Impact of growth pressure and annealing temperature on their microstructural architectures

Abstract

High-quality copper oxide (CuO) thin films were deposited on the silicon (Si) substrate at the room temperature using the physical vapour deposition (PVD) technique named radio frequency (RF) sputtering. The copper-oxide thin-films were single crystalline and of uniform thickness. Subsequently, the influence of growth pressure (low gas pressure - 3 mTorr and high gas pressure - 100 mTorr) and post growth annealing at different temperatures (300 °C to 700 °C) were investigated to understand the microstructural and morphological changes of the thin film. With the influence of growth pressure and post thermal annealing temperature, significant changes in crystallinity, surface roughness, and surface oxidation rate of the CuO thin film were detected, which were adequately analyzed via several characterization techniques. X-ray diffraction (XRD) patterns revealed the phase formation with good crystallinity of the film, which is substantiated by Raman spectroscopy and X-ray photoelectron spectroscopy (XPS) characterization. Atomic force microscopy (AFM) images disclosed that the surface roughness of the film and grain size. By gaining insights into the structural and surface properties of CuO/Si thin films, this research presents new prospects for tuning of CuO phases, structures, and compositions for multifunctional applications.

Keywords

• CuO thin films
• RF sputtering
• Post annealing
• Crystalline size
• Stress and strain
• Surface roughness