Tunnel Encapsulation Technology for Durability Improvement in Stretchable Electronics Fabrication

Abstract

Great diversity of process technologies and materials have been developed around stretchable electronics. A subset of them, which are made up of zigzag metal foil and soft silicon polymers, show advantages of being easy to manufacture and low cost. However, most of the circuits lack durability due to stress concentration of interconnects entirely embedded in elastic polymer silicone such as polydimethylsiloxane (PDMS). In our demonstration, tunnel encapsulation technology was introduced to relieve stress of these conductors when they were stretched to deform in and out of plane. It was realized by dissolving the medium of Polyvinyl Alcohol (PVA), previous cured together with circuits in polymer, to form the micro-tunnel which not only guarantee the stretchability of interconnect, but also help to improve the durability. With the protection of tunnel, the serpentine could stably maintain the designed shape and electrical performance after 50% strain cycling over 20,000 times. Finally, different materials for encapsulation were employed to provide promising options for applications in portable biomedical devices which demand duplicate distortion.

Keywords

• stretchable electronics
• tunnel encapsulation
• Polyvinyl Alcohol
• durability