Solder Wear Study on Electronic Boards using Nanoindentantions

Abstract

This paper presents a method for analysing the differences in solder interfaces between a new and an used printed circuit board (PCB). The study was carried out using the nanoindentation technique, the properties analysed being those of homogeneity, elasticity/rigidity of the solder paste on the contact areas. The analysed areas were selected after a few images obtained with the scanning electron microscope (SEM). The research was carried out in order to find out the possible causes of the defects appearance after a long time of use, it can be very difficult to find out the cause using the nanometre scale.

Keywords

• pcb
• nanoindentation
• sem