Using nitrogen-containing organosilicon compounds in the creation of heat- and fire-resistant filling compositions to seal high-voltage and high-frequency equipment

Abstract

Objectives. To study the possibility of using nitrogen-containing organosilicon compounds in the creation of heat-resistant and fireresistant casting compositions to seal high-voltage high-frequency equipment.Methods. Nitrogen-containing organosilicon compounds were obtained using the N-siloxycarbonylation, formylation, and silylation methods. The methods used in the work were infrared spectroscopy, elemental analysis, viscometry, and differential scanning calorimetry. The mechanical and dielectric properties of the samples were determined.Results. Previously unknown substances and compounds containing nitrogen-containing organosilicon products as components of the curing composition were obtained. Their physicomechanical and operational properties were examined, including the possibility of using them as filling heat-resistant and fire-resistant compositions for sealing high-voltage and high-frequency equipment.Conclusions. It was shown that nitrogen-containing organosilicon compounds — 3-(diethylamino)-2-[(triethoxysilyl)oxy]propyl-2-methacrylate and triethoxysilyl ester of γ-triethoxysilylpropyl-carbamic acid — can be used as part of a curing system together with bromine-containing fillers, in order to obtain compounds used for filling high-voltage high-frequency transformers, throttle valves, and other electronic equipment elements with non-combustible properties and increased heat resistance.

Keywords

• nitrogen-containing organosilicon compounds
• filling compositions
• heat-resistant and fire-resistant filling compositions
• sealing high-voltage and high-frequency equipment