Nature Communications (Feb 2021)
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
- Arne Quellmalz,
- Xiaojing Wang,
- Simon Sawallich,
- Burkay Uzlu,
- Martin Otto,
- Stefan Wagner,
- Zhenxing Wang,
- Maximilian Prechtl,
- Oliver Hartwig,
- Siwei Luo,
- Georg S. Duesberg,
- Max C. Lemme,
- Kristinn B. Gylfason,
- Niclas Roxhed,
- Göran Stemme,
- Frank Niklaus
Affiliations
- Arne Quellmalz
- Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology
- Xiaojing Wang
- Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology
- Simon Sawallich
- Protemics GmbH
- Burkay Uzlu
- Chair of Electronic Devices, Faculty of Electrical Engineering and Information Technology, RWTH Aachen University
- Martin Otto
- AMO GmbH, Advanced Microelectronic Center Aachen (AMICA)
- Stefan Wagner
- AMO GmbH, Advanced Microelectronic Center Aachen (AMICA)
- Zhenxing Wang
- AMO GmbH, Advanced Microelectronic Center Aachen (AMICA)
- Maximilian Prechtl
- Institute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr München
- Oliver Hartwig
- Institute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr München
- Siwei Luo
- Institute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr München
- Georg S. Duesberg
- Institute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr München
- Max C. Lemme
- Chair of Electronic Devices, Faculty of Electrical Engineering and Information Technology, RWTH Aachen University
- Kristinn B. Gylfason
- Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology
- Niclas Roxhed
- Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology
- Göran Stemme
- Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology
- Frank Niklaus
- Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology
- DOI
- https://doi.org/10.1038/s41467-021-21136-0
- Journal volume & issue
-
Vol. 12,
no. 1
pp. 1 – 11
Abstract
The existing integration approaches for 2D materials often degrade material properties and are not compatible with industrial processing. Here, the authors devise an adhesive wafer bonding strategy to transfer and stack monolayers, suitable for back end of the line integration of 2D materials.
