Informacije MIDEM (Dec 2021)

Horizontal Crack Induced Vertical Crack Formation in Epoxy Mold Compound for Electronic Packaging

  • S. M. M. S. M. Zain,
  • A. Jalar,
  • M. Abu Bakar,
  • F. Che Ani,
  • M. R. Ramli

DOI
https://doi.org/10.33180/InfMIDEM2021.406
Journal volume & issue
Vol. 51, no. 4
pp. 261 – 266

Abstract

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Keywords