EPJ Web of Conferences (May 2011)

Diffusion coefficient of copper, tin and copper tin alloy

  • Makradi A.,
  • Grosdidier B.,
  • Hellal S.,
  • Mouas M.,
  • Gasser J.-G.,
  • Belouettar S.

DOI
https://doi.org/10.1051/epjconf/20111501013
Journal volume & issue
Vol. 15
p. 01013

Abstract

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Pseudopotential formalism is used to construct an ionic effective potential (ion-ion potential screened by electrons). Molecular Dynamics is used in conjunction with the constructed effective potential to get the atomic structure factor of the pure components copper and tin which are compared to the experimental ones. We selected the Shaw Optimized Model Potential having proved that it adequately describes the atomic structure, we used it to calculate the velocity autocorrelation function and to deduce the self diffusion of pure metals: copper, tin and the diffusion coefficient of copper in the Sn95,6%Cu4,4% .