AIP Advances (Sep 2015)

Influence of the gate edge on the reverse leakage current of AlGaN/GaN HEMTs

  • YongHe Chen,
  • XiaoHua Ma,
  • WeiWei Chen,
  • Bin Hou,
  • JinCheng Zhang,
  • Yue Hao

DOI
https://doi.org/10.1063/1.4931454
Journal volume & issue
Vol. 5, no. 9
pp. 097154 – 097154-7

Abstract

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By comparing the Schottky diodes of different area and perimeter, reverse gate leakage current of AlGaN/GaN high mobility transistors (HEMT) at gate bias beyond threshold voltage is studied. It is revealed that reverse current consists of area-related and perimeter-related current. An analytical model of electric field calculation is proposed to obtain the average electric field around the gate edge at high revers bias and estimate the effective range of edge leakage current. When the reverse bias increases, the increment of electric field is around the gate edge of a distance of ΔL, and perimeter-related gate edge current keeps increasing. By using the calculated electric field and the temperature-dependent current-voltage measurements, the edge gate leakage current mechanism is found to be Fowler-Nordheim tunneling at gate bias bellows -15V caused by the lateral extended depletion region induced barrier thinning. Effective range of edge current of Schottky diodes is about hundred to several hundred nano-meters, and is different in different shapes of Schottky diodes.