Nanomaterials (Aug 2022)

Deposition Mechanism and Characterization of Plasma-Enhanced Atomic Layer-Deposited SnO<i><sub>x</sub></i> Films at Different Substrate Temperatures

  • Pao-Hsun Huang,
  • Zhi-Xuan Zhang,
  • Chia-Hsun Hsu,
  • Wan-Yu Wu,
  • Sin-Liang Ou,
  • Chien-Jung Huang,
  • Dong-Sing Wuu,
  • Shui-Yang Lien,
  • Wen-Zhang Zhu

DOI
https://doi.org/10.3390/nano12162859
Journal volume & issue
Vol. 12, no. 16
p. 2859

Abstract

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The promising functional tin oxide (SnOx) has attracted tremendous attention due to its transparent and conductive properties. The stoichiometric composition of SnOx can be described as common n-type SnO2 and p-type Sn3O4. In this study, the functional SnOx films were prepared successfully by plasma-enhanced atomic layer deposition (PEALD) at different substrate temperatures from 100 to 400 °C. The experimental results involving optical, structural, chemical, and electrical properties and morphologies are discussed. The SnO2 and oxygen-deficient Sn3O4 phases coexisting in PEALD SnOx films were found. The PEALD SnOx films are composed of intrinsic oxygen vacancies with O-Sn4+ bonds and then transformed into a crystalline SnO2 phase with increased substrate temperature, revealing a direct 3.5–4.0 eV band gap and 1.9–2.1 refractive index. Lower (300 °C) substrate temperatures can cause precursor condensation and desorption, respectively, resulting in reduced film qualities. The proper composition ratio of O to Sn in PEALD SnOx films near an estimated 1.74 suggests the highest mobility of 12.89 cm2 V−1 s−1 at 300 °C.

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