Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders

Gui-sheng Gan; Tian Huang; Shi-qi Chen; Liu-jie Jiang; Da-yong Cheng; Shu-ye Zhang

Memories - Materials, Devices, Circuits and Systems (Jul 2023)

Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders

Gui-sheng Gan,
Tian Huang,
Shi-qi Chen,
Liu-jie Jiang,
Da-yong Cheng,
Shu-ye Zhang

Affiliations

Gui-sheng Gan: Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, China; Golden Dragon Precise Copper Tube Group Inc, Chongqing 404000, China; Jiangsu Jiuxiang Automotive Electrical Group Co., Ltd, Xuzhou 221200, China; Corresponding author at: Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, China.
Tian Huang: Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, China
Shi-qi Chen: Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, China
Liu-jie Jiang: Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, China
Da-yong Cheng: Golden Dragon Precise Copper Tube Group Inc, Chongqing 404000, China
Shu-ye Zhang: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China; Corresponding author.

Journal volume & issue: Vol. 4
p. 100026

Abstract

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Composite solders of 1μmZn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μmwas used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) between Cu substrates and solder were mainly smooth Cu5Zn8, and the Zn–Sn–Cu phase was formed to complete interconnection between SAC0307 particles at 180 °C. With the increase of aging time, the shear strength of joints first increased and reached a peak value of 36.26MPa at 2h which was 21.8% higher than that of the as-received joints, then the shear strength decreased and tended to be stable at 24h which was increased by 10.0% compared with that of the as-received joints.

Published in Memories - Materials, Devices, Circuits and Systems

ISSN: 2773-0646 (Online)
Publisher: Elsevier
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Electric apparatus and materials. Electric circuits. Electric networks; Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics: Computer engineering. Computer hardware
Website: https://www.sciencedirect.com/journal/memories-materials-devices-circuits-and-systems

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