Fast simulation of transient temperature distributions in power modules using multi-parameter model reduction

Abstract

In this study, a three-dimensional model with multi-parameter order reduction is applied to the thermal modelling of power electronics modules with complex geometries. Finite element or finite difference method can be used to establish accurate mathematical models for thermal analyses. Unfortunately, the resulting computational complexity hinders the analysis in parametric studies. This study proposes a parametric order reduction technique that can significantly increase simulation efficiency without significant penalty in the prediction accuracy. The method, based on the block Arnoldi method, is illustrated with reference to a multi-chip SiC power module mounted on a forced air-cooled finned heat sink with a variable mass flow rate.

Keywords

• finite element analysis
• heat sinks
• power electronics
• finite difference methods
• cooling
• temperature distribution
• silicon compounds
• reduced order systems
• transient temperature distributions
• power modules
• multiparameter model reduction
• three-dimensional model
• multiparameter order reduction
• thermal modelling
• power electronics modules
• complex geometries
• accurate mathematical models
• thermal analyses
• parametric order reduction technique
• simulation efficiency
• block Arnoldi method
• fast simulation
• finite element method
• finite difference method
• computational complexity
• multichip silicon carbide power module
• forced air-cooled finned heat sink
• variable mass flow rate
• SiC