Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging

Abstract

The miniaturization of power conversion systems requires high-power density operation of power modules, causing the heat-density increase. Therefore, it is essential to develop bonding technology to realize highly thermally conductive and reliable high-temperature joints. In this study, we propose a novel anisotropic microcomposite (AMC) joint that integrates a lotus-type porous Cu (LPC) sheet and Sn-based solder for high-temperature electronic applications. The AMC joint was successfully fabricated by infiltrating the molten solder into the unidirectional pores of the LPC sheet during a simple reflow process. Steady-state thermal conductivity measurements for a uniquely designed specimen revealed its equivalent thermal conductivity (142.4 W/m·K), 2.5 times higher than the solder. Finite element simulations supported its excellent thermal performance by investigating the heat flux distribution and thermal conductivity prediction that utilize a three-dimensional image-based constructed model. In addition, the aging test at 200 °C for 1008 h clarified a stable shear strength of over 46 MPa. This indicates a reliable mechanical performance at 200 °C, which is only 20 °C below the melting point of the solder. These experimental and numerical studies proved the potential of the novel joint as a high-temperature electronics joint and offered possible mechanisms for its thermal and mechanical property enhancement.

Keywords

• Anisotropic microcomposite joint
• Lotus-type porous material
• Thermal conductivity
• High temperature reliability
• High temperature aging
• Finite element simulation