A Novel Approach to Enhance Mechanical and Thermal Properties of SLA 3D Printed Structure by Incorporation of Metal–Metal Oxide Nanoparticles

Abstract

Silver (Ag) ornamented TiO2 semiconducting nanoparticles were synthesized through the sol-gel process to be utilized as nanofillers with photo resin to enhance the mechanical and thermal properties of stereolithography 3D printed objects. The as-prepared Ag-TiO2 nanoparticles (Ag-TNP) were typified and qualified by XRD, XPS, Raman, and FESEM; TEM analysis dissected the morphologies. The enhancement in the tensile and flexural strengths of SLR/Ag-TNP nanocomposites was noted as 60.8% and 71.8%, respectively, at the loading content of 1.0% w/w Ag-TNP within the SLR (stereolithography resin) matrix. Similarly, the thermal conductivity and thermal stability were observed as higher for SLR/Ag-TNP nanocomposites, equated to neat SLR. The nanoindentation investigation shows an excerpt hike in reduced modulus and hardness by the inclusion of Ag-TNP. The resulted thermal analysis discloses that the introduction of Ag-TNP can appreciably augment the glass transition temperature (Tg), and residual char yield of SLR nanocomposites remarkably. Hence, the significant incorporation of as-prepared Ag-TNP can act as effective nanofillers to enhance the thermal and mechanical properties of photo resin.

Keywords

• nanocomposites
• stereolithography 3d printing
• semiconducting nanoparticles
• mechanical properties
• thermal properties
• rheological properties