Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

Abstract

The incorporation and doping of elements represent a widely used approach to enhance the solidity, integrity, and characteristics of pb-free solder joints. The present study summarizes the incorporation of indium and its impact on the mechanical aspects of the SAC105 pb-free solder alloy. To refine the mechanical impact of the solder alloy, the evaluation of samples were categorized into three groups: as-cast, low-thermal aged (at 125 °C), and high-thermal aged (at 180 °C). The tensile deformation data were obtained via the universal tensile machine (UTM). Investigational findings demonstrated the enhancement in mechanical characteristics, including ultimate tensile and yield strength of the solder alloy. The addition of 1 wt.% of indium to SAC105 led to a notable increase in ultimate tensile strength, rising from 29.6 MPa to 35.31 MPa, which corresponds to an approximate 19.30% increase over the initial value.

Keywords

• lead-free soldering material
• SAC105
• UTM
• ultimate tensile strength
• indium-lead-tin-copper