To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints

Abstract

We report here an approach to inhibit Cu–Sn intermetallic compounds (IMCs) in flip chip solder joints under thermal-gradient annealing. We reflowed two types of solders joints, Cu/SnAg/Cu and Cu/SnAg/Ni, in an oven (isothermal) and on a hot plate (with thermal-gradient) at 260 °C. During the isothermal reflow, the IMC growth rates in the top and bottom sides of the solder joint were ∼4.0 × 10−2 and 8.9 × 10−2 μm/min, respectively. However, the IMC growth rate increased to 7.8 × 10−1, 7.9 × 10−1, and 8.9 × 10−1 μm/min in the cold ends with low, medium, and high thermal gradients, respectively. Yet, the IMC thickness on the hot ends remained almost unchanged. These results indicate that the thermal gradient has facilitated the Cu–Sn IMC formation in the cold ends. But, when a Ni film was sandwiched at the cold end, the IMC growth rates in the cold end were reduced to ∼9.7 × 10−2, 1.4 × 10−1, and 1.5 × 10−1 μm/min with low, medium, and high thermal gradients, respectively, indicating that the thermomigration of IMCs was retarded by the Ni. It is speculated that the Ni layer transformed the IMCs on the hot end into stable (Cu,Ni)6Sn5 ternary IMCs, and thus the thermomigration of Cu was suppressed. A kinetic model is also proposed to address the competitive reactions of Cu-molten solder joints.

Keywords

• Thermomigration
• Ni metallization
• Intermetallic compounds
• Solder joints