Nature Communications (Feb 2023)

Wafer-scale and universal van der Waals metal semiconductor contact

  • Lingan Kong,
  • Ruixia Wu,
  • Yang Chen,
  • Ying Huangfu,
  • Liting Liu,
  • Wei Li,
  • Donglin Lu,
  • Quanyang Tao,
  • Wenjing Song,
  • Wanying Li,
  • Zheyi Lu,
  • Xiao Liu,
  • Yunxin Li,
  • Zhiwei Li,
  • Wei Tong,
  • Shuimei Ding,
  • Songlong Liu,
  • Likuan Ma,
  • Liwang Ren,
  • Yiliu Wang,
  • Lei Liao,
  • Xidong Duan,
  • Yuan Liu

DOI
https://doi.org/10.1038/s41467-023-36715-6
Journal volume & issue
Vol. 14, no. 1
pp. 1 – 8

Abstract

Read online

Laminated van der Waals (vdW) metallic electrodes can improve the contact of 2D electronic devices, but their scalability is usually limited by the transfer process. Here, the authors report a strategy to deposit vdW contacts onto various 2D and 3D semiconductors at the wafer scale.