An improved planar module automatic layout method for large number of dies

Abstract

The layout of power modules is one of the key points in power module design, especially for silicon carbide module, which may parallel more devices compared with silicon counterpart. In this paper, along with the design example, a improved layout design method for planar power modules is presented. Some practical considerations and implementations are also introduced in the optimization of module layout design.

Keywords

• multi-chip module
• packaging