Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

Fan Yang; Liang Zhang; Zhi-quan Liu; Su Juan Zhong; Jia Ma; Li Bao

doi:10.3390/ma10050558

Materials (May 2017)

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

Fan Yang,
Liang Zhang,
Zhi-quan Liu,
Su Juan Zhong,
Jia Ma,
Li Bao

Affiliations

Fan Yang: School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China
Liang Zhang: School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China
Zhi-quan Liu: Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Su Juan Zhong: State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Institute of Mechanical Engineering, Zhengzhou 450001, China
Jia Ma: State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Institute of Mechanical Engineering, Zhengzhou 450001, China
Li Bao: State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Institute of Mechanical Engineering, Zhengzhou 450001, China

DOI: https://doi.org/10.3390/ma10050558
Journal volume & issue: Vol. 10, no. 5
p. 558

Abstract

Read online

With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate.

Published in Materials

ISSN: 1996-1944 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering; Technology: Engineering (General). Civil engineering (General); Science: Natural history (General): Microscopy; Science: Physics: Descriptive and experimental mechanics
Website: http://www.mdpi.com/journal/materials/

About the journal

Abstract

Keywords