Analysis of Adhesive Distribution over Particles According to Their Size and Potential Savings from Particle Surface Determination

Abstract

Wood and its processing into particles are, combined, the largest cost factor in the production of particleboard, followed by the cost of adhesive. Thus, reducing their cost is a goal of process optimization. This study investigated whether possible savings could be identified and quantified by determining the particle surface using automated three-dimensional laser-scanning technology (3D Particleview, Fagus-Grecon). The focus was on saving adhesive by sieving out adhesive-consuming fines. It was shown that, currently, with the actual prices for wood (89 €/t), particle preparation (37 €/t), and adhesive (570 €/t), the resulting additional costs for particles are overcompensated by the savings for adhesive with high adhesive content (e.g., 19%). The assumption of uniform distribution of adhesive on the total surface of all particles was checked for correctness using digital reflected light microscopy (VHX-5000, Keyence). Since urea-formaldehyde (UF) adhesive commonly used in particleboard production can only be detected with increased effort, phenol-formaldehyde (PF) adhesive was applied for the tests. Ultraviolet microspectrophotometry (UMSP) was used to rule out excessive penetration of the adhesive into the wooden tissue of the particles. The examination of the distribution of the adhesive over the surface showed that smaller particle sizes tended to be more heavily coated with adhesive. This means that the calculated savings still underestimate the real-life potential or that potential savings exist even with lower adhesive prices or higher prices for wood.

Keywords

• particleboard
• particle size analysis
• sieve fraction
• adhesive distribution
• GreCon 3D Particleview
• 3D laser line profile sensor