The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites
Zhengdong Wang,
Tong Zhang,
Jinkai Wang,
Ganqiu Yang,
Mengli Li,
Guanglei Wu
Affiliations
Zhengdong Wang
School of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, China
Tong Zhang
School of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, China
Jinkai Wang
School of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, China
Ganqiu Yang
School of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, China
Mengli Li
School of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, China
Guanglei Wu
State Key Laboratory of Bio-Fibers and Eco-Textiles, Institute of Materials for Energy and Environment, College of Materials Science and Engineering, Qingdao University, Qingdao 266071, China
Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed to improve the through-plane thermal conductivity of epoxy composites using a 3D boron nitride (3D-BN) framework. In addition, the effect of filler sizes in 3D-BN skeletons on thermal conductivity was investigated. The epoxy composite with larger BN in lateral size showed a higher through-plane thermal conductivity of 2.01 W/m·K and maintained a low dielectric constant of 3.7 and a dielectric loss of 0.006 at 50 Hz, making it desirable for the application in microelectronic devices.
