Versatile On‐Chip Programming of Circuit Hardware for Wearable and Implantable Biomedical Microdevices

Abstract

Abstract Wearable and implantable microscale electronic sensors have been developed for a range of biomedical applications. The sensors, typically millimeter size silicon microchips, are sought for multiple sensing functions but are severely constrained by size and power. To address these challenges, a hardware programmable application‐specific integrated circuit design is proposed and post‐process methodology is exemplified by the design of battery‐less wireless microchips. Specifically, both mixed‐signal and radio frequency circuits are designed by incorporating metal fuses and anti‐fuses on the top metal layer to enable programmability of any number of features in hardware of the system‐on‐chip (SoC) designs. This is accomplished in post‐foundry editing by combining laser ablation and focused ion beam processing. The programmability provided by the technique can significantly accelerate the SoC chip development process by enabling the exploration of multiple internal circuit parameters without the requirement of additional programming pads or extra power consumption. As examples, experimental results are described for sub‐millimeter size complementary metal‐oxide‐semiconductor microchips being developed for wireless electroencephalogram sensors and as implantable microstimulators for neural interfaces. The editing technique can be broadly applicable for miniaturized biomedical wearables and implants, opening up new possibilities for their expedited development and adoption in the field of smart healthcare.

Keywords

• application‐specific integrated circuits
• biomedical implant
• focused ion beam
• laser ablation
• post‐CMOS processing
• programmable microdevices