Influence of temperature on the soldering process of CLCC-3 package components using AuSn20 solder
Zhihuan Zhao,
Guanghao Gong,
Mingming Jiang,
Chuanzhong Chen,
Peng Li,
Weihai Song,
Zhibin Zhao,
Li Zhang,
Huijun Yu
Affiliations
Zhihuan Zhao
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education) and Shandong Engineering Research Center for Superhard Material, Department of Materials Science and Engineering, Shandong University, Jinan 250061, China
Guanghao Gong
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education) and Shandong Engineering Research Center for Superhard Material, Department of Materials Science and Engineering, Shandong University, Jinan 250061, China
Mingming Jiang
School of Mechanical and Electronic Engineering, Shandong Agricultural and Engineering University, Jinan 250100, China
Chuanzhong Chen
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education) and Shandong Engineering Research Center for Superhard Material, Department of Materials Science and Engineering, Shandong University, Jinan 250061, China
Peng Li
School of Mechanical and Electronic Engineering, Shandong Agricultural and Engineering University, Jinan 250100, China
Weihai Song
School of Mechanical and Electronic Engineering, Shandong Agricultural and Engineering University, Jinan 250100, China
Zhibin Zhao
Lihuayi Group Co., Ltd., Lijin, Dongying 257400, China
Li Zhang
Jinan Semiconductor Research Institute, Jinan 250014, China
Huijun Yu
Key Laboratory of High-Efficiency and Clean Mechanical Manufacture (Ministry of Education) and National Demonstration Center for Experimental Mechanical Engineering Education, School of Mechanical Engineering, Shandong University, Jinan 250061, China
In this study, a CLCC-3 shell and a cover were connected via soldering with AuSn20 as the solder. An Au–Sn eutectic reaction occurred during the sealing process. At high soldering temperatures, only the eutectic ζ′-Au5Sn and δ-AuSn phases remained. At the interface between the solder and the Au/Ni coating, Ni entered Au5Sn and AuSn to form (Au,Ni)5Sn and (Au,Ni)Sn and Au entered the lattice of the Ni3Sn2 phase to form the ternary compound (Ni,Au)3Sn2. The experimental results demonstrated that at a soldering heating plate temperature of 320 °C, the structure of the soldering area was compact and there were no holes in the soldering area. Under these conditions, the macroscopic appearance of the product improved, the solder was sufficiently melted, and the cover plate was well infiltrated, which resulted in the formation of a good, dense connection with the base plate.
