Materials (Jun 2020)

Development of Na<sub>0.5</sub>CoO<sub>2</sub> Thick Film Prepared by Screen-Printing Process

  • Akihiro Tsuruta,
  • Miki Tanaka,
  • Masashi Mikami,
  • Yoshiaki Kinemuchi,
  • Yoshitake Masuda,
  • Woosuck Shin,
  • Ichiro Terasaki

DOI
https://doi.org/10.3390/ma13122805
Journal volume & issue
Vol. 13, no. 12
p. 2805

Abstract

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The Na0.5Co0.9Cu0.1O2 thick film with the same thermoelectric performance as a Na0.5CoO2 bulk was formed on an alumina substrate by the screen-printing process. The power factor exceeded 0.3 mW/K2m, with the resistivity of 3.8 mΩcm and the thermopower of 108 μV/K. The thick film without any cracks strongly adhered to the substrate. The high-quality thick film had been realized through the carefully designed and improved process, mixing NaCl to promote the anisotropic sintering of Na0.5Co0.9Cu0.1O2, inserting a CuO interlayer to adhere the film and substrate, and Co–Cu substituting Cu for Co to control the sintering temperature.

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