Synthesis of tolyl guanidine as copper corrosion inhibitor with a complementary study on electrochemical and in silico evaluation

Abstract

Abstract A rapid and new synthetic route for N,N′-di-o-tolyl guanidine (DTG) synthesis from cheap materials is reported. The performance of DTG as an excellent inhibitor for delaying copper (Cu) corrosion with an efficiency higher than 98% at 20 × 10−6 M in an acidic solution was investigated via electrochemical measurements. These measurements included PDP, EFM, and EIS spectroscopy. The experimental data indicated that DTG has an efficient inhibiting effect on the corrosion of Cu in acidic media.The DTG was adsorbed on to the Cu surface via chemical adsorption and followed the Langmuir route. The PDP measurements revealed that DTG acted as a mixed inhibitor. Furthermore, EIS data showed that the DTG adsorbed through the metal/electrolyte interface. This resulted in forming a DTG protective layer on the Cu surface, thereby impeding the dissolution of Cu in the acidic solution. The corrosive solution containing the DTG inhibitor after immersion of the Cu specimen for 48 h, which promoted the formation of a complex between the Cu cation and DTG, was investigated via ultraviolet/visible spectroscopy. In addition, the formation of a DTG protective layer on the Cu surface was confirmed via scanning electron microscopy and atomic force microscopy analysis of the Cu surface morphology. Moreover, the active centers for interaction with the Cu surface in an acidic solution were investigated via in silico evaluation of DTG.