Vertical integration of microchips by magnetic assembly and edge wire bonding

Abstract

Hands-off production of 3D sensing microsystems A strategy for the magnetically assisted vertical assembly of microchips into their substrates and for their electrical connection could offer a versatile solution for the construction of fragile and complex miniaturized sensors. Conventional contact-based assembly methods such as pick-and-place manipulation have the potential to damage these sensitive parts, while existing contactless approaches offer poor control for high-volume manufacturing. Researchers led by Xiaojing Wang and Federico Ribet at the KTH Royal Institute of Technology in Sweden have now devised a manufacturing method that enables efficient construction of such devices. Their technique relies on matched microchip-substrate geometries, with patterned ferromagnetic material to guide assembly, and wire bonding to establish interconnections. This manufacturing process can be performed under conventional conditions at room temperature and should offer a versatile and robust means for producing 3D microelectromechanical system (MEMS) components.