Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Ming-Ding Li; Xiao-Quan Shen; Xin Chen; Jia-Ming Gan; Fang Wang; Jian Li; Xiao-Liang Wang; Qun-Dong Shen

doi:10.1038/s41467-022-33596-z

Nature Communications (Oct 2022)

Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Ming-Ding Li,
Xiao-Quan Shen,
Xin Chen,
Jia-Ming Gan,
Fang Wang,
Jian Li,
Xiao-Liang Wang,
Qun-Dong Shen

Affiliations

Ming-Ding Li: Department of Polymer Science and Engineering, MOE Key Laboratory of High Performance Polymer Materials and Technology, School of Chemistry and Chemical Engineering, Nanjing University
Xiao-Quan Shen: Department of Polymer Science and Engineering, MOE Key Laboratory of High Performance Polymer Materials and Technology, School of Chemistry and Chemical Engineering, Nanjing University
Xin Chen: Materials Research Institute, The Pennsylvania State University
Jia-Ming Gan: Department of Polymer Science and Engineering, MOE Key Laboratory of High Performance Polymer Materials and Technology, School of Chemistry and Chemical Engineering, Nanjing University
Fang Wang: Department of Polymer Science and Engineering, MOE Key Laboratory of High Performance Polymer Materials and Technology, School of Chemistry and Chemical Engineering, Nanjing University
Jian Li: State Key Laboratory of Analytical Chemistry for Life Science, School of Chemistry and Chemical Engineering, Nanjing University
Xiao-Liang Wang: Department of Polymer Science and Engineering, MOE Key Laboratory of High Performance Polymer Materials and Technology, School of Chemistry and Chemical Engineering, Nanjing University
Qun-Dong Shen: Department of Polymer Science and Engineering, MOE Key Laboratory of High Performance Polymer Materials and Technology, School of Chemistry and Chemical Engineering, Nanjing University

DOI: https://doi.org/10.1038/s41467-022-33596-z
Journal volume & issue: Vol. 13, no. 1
pp. 1 – 8

Abstract

Read online

Efficient thermal structure and precise heat management become a substantial challenge for electronics. Here, authors utilize the synergistic effect of classic heat transfer and electrocaloric cooling for fixed-point thermal management of chips.

Published in Nature Communications

ISSN: 2041-1723 (Online)
Publisher: Nature Portfolio
Country of publisher: United Kingdom
LCC subjects: Science
Website: https://www.nature.com/ncomms/

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