Investigation of Thermal Stability of Microstructure and Mechanical Properties of Bimetallic Fine-Grained Wires from Al–0.25%Zr–(Sc,Hf) Alloys

Abstract

Thermal stability of composite bimetallic wires from five novel microalloyed aluminum alloys with different contents of alloying elements (Zr, Sc, and Hf) is investigated. The alloy workpieces were obtained by induction-casting in a vacuum, preliminary severe plastic deformation, and annealing providing the formation of a uniform microstructure and the nucleation of stabilizing intermetallide Al3(Zr,Sc,Hf) nanoparticles. The wires of 0.26 mm in diameter were obtained by simultaneous deformation of the Al alloy with Cu shell. The bimetallic wires demonstrated high strength and improved thermal stability. After annealing at 450–500 °C, a uniform fine-grained microstructure formed in the wire (the mean grain sizes in the annealed Al wires are 3–5 μm). An increased hardness and strength due to nucleation of the Al3(Sc,Hf) particles was observed. A diffusion of Cu from the shell into the surface layers of the Al wire was observed when heating up to 400–450 °C. The Cu diffusion depth into the annealed Al wire surfaces reached 30–40 μm. The maximum elongation to failure of the wires (20–30%) was achieved after annealing at 350 °C. The maximum values of microhardness (Hv = 500–520 MPa) and of ultimate strength (σb = 195–235 MPa) after annealing at 500 °C were observed for the wires made from the Al alloys alloyed with 0.05–0.1% Sc.

Keywords

• aluminum alloys
• microalloying
• microhardness
• electrical conductivity
• zirconium
• scandium