Multi-material 3D printed electronic assemblies: A review

Abstract

Printed circuit assemblies (PCAs) are an integral part of most modern electronic devices. With the significant supply chain issues affecting the electronics industry there has been renewed interest in new ways to reshore and revitalise the electronics manufacturing sectors. A PCA is composed of a substrate, interconnections, passive and/or active components which when combined allow an electronic device to function. These constituents are made of a variety of materials including conductive, insulating and semiconductor. In considering the application of 3D printing (3DP) to the manufacture of PCAs a necessary criterion would be the need for multi-material 3D printing (MM3DP). The aim of this review is to report on the recent progress in the application of MM3DP technologies for the manufacture of PCAs. Emphasis is placed on the realisation of fully automated, standalone MM3DP systems. The review identifies the dominant MM3DP technologies utilised in the industry as well as the limitations of the currently available technologies. Finally, the review proposes five characteristics of the ideal MM3DP system for manufacturing PCAs and discusses the important opportunities for future research in each of the areas.

Keywords

• Additive manufacturing
• Multi-material
• 3D printed electronics
• 3D printing