Sensors (Nov 2017)

Laser Scanning Confocal Thermoreflectance Microscope for the Backside Thermal Imaging of Microelectronic Devices

  • Dong Uk Kim,
  • Chan Bae Jeong,
  • Jung Dae Kim,
  • Kye-Sung Lee,
  • Hwan Hur,
  • Ki-Hwan Nam,
  • Geon Hee Kim,
  • Ki Soo Chang

DOI
https://doi.org/10.3390/s17122774
Journal volume & issue
Vol. 17, no. 12
p. 2774

Abstract

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In this paper, we report on a confocal thermoreflectance imaging system that can examine the thermal characteristics of microelectronic devices by penetrating the backside of a device through the substrate. In this system, the local reflectivity variations due to heat generation in the device are measured point by point by a laser scanning confocal microscope capable of eliminating out-of-focus reflections and the thermoreflectance is extracted via Fourier-domain signal processing. In comparison to the conventional widefield thermoreflectance microscope, the proposed laser scanning confocal thermoreflectance microscope improves the thermoreflectance sensitivity by ~23 times and the spatial resolution by ~25% in backside thermoreflectance measurements.

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