Enhancing plasma discharge dynamics through analysis of secondary electron emission: A numerical modeling approach for improved thin film deposition

Abstract

This research examines the impact of the coefficient of secondary electron emission (SEE) on various discharge features of plasma to improve the performance of deposited thin films. Unlike previous studies, we employed two-dimensional numerical modeling (2D) of an ICP reactor at a radiofrequency of 13.56 MHz and a low pressure of 1 Torr, using a finite element approach. This detailed investigation into parameters such as ionization rate, electric field, electron temperature, and electron density provides new insights into plasma interactions. Our findings reveal a significant correlation between the SEE coefficient and key plasma attributes. Notably, increased secondary electrons lead to a substantial rise in electron density and a reduction in sheath thickness, indicating an impactful change in the spatial distribution of plasma particles. Additionally, electron temperature increases exclusively in sheath regions, a novel observation not reported in earlier studies. Furthermore, higher SEE coefficients correlate with increased ionization rates within each sheath, suggesting a crucial role in maintaining discharge processes. This comprehensive analysis uncovers complex interdependencies within the plasma discharge system, offering valuable advancements for thin film deposition techniques.

Keywords

• Discharge plasma
• Numerical modeling
• Inductively coupled plasma
• Secondary electron emission
• Thin film deposition