Engineering and Technology Journal (May 2012)

Plane Flow Analysis for a Profile Extrusion Die Using Digital Image processing Technique

  • Salah K. Jawad,
  • Ali Abbar Khleif,
  • Mohanad Q. Abbood

DOI
https://doi.org/10.30684/etj.30.9.10
Journal volume & issue
Vol. 30, no. 9
pp. 1562 – 1581

Abstract

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This paper investigates the applicability of the proposed digital image correlation (DIC) system instead of traditional method by microscope to measure the strains in forward extrusion process, which conducted for rectangular section with plane strain condition by using taper die at angle (2 = 90 ̊) and the proportion of reduction in area is (42.85 %). Commercial pure lead (99.99% Pb) was chosen as a typical pattern to measure the strain and strain rate for the forward extrusion process by a visio-plasticity technique and the proposed digital image correlation system. The obtained results indicate that the proposed digital image correlation (DIC) system is an accurate and reliable for measuring the strains using inexpensive equipments

Keywords