Study of Inkjet-Printed Silver Films Based on Nanoparticles and Metal-Organic Decomposition Inks with Different Curing Methods
Peng Xiao,
Yicong Zhou,
Liao Gan,
Zhipeng Pan,
Jianwen Chen,
Dongxiang Luo,
Rihui Yao,
Jianqiu Chen,
Hongfu Liang,
Honglong Ning
Affiliations
Peng Xiao
School of Physics and Optoelectronic Engineering, Foshan University, Foshan 528000, China
Yicong Zhou
Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China
Liao Gan
Air Force Representative Office in Zunyi District, Zunyi 563000, China
Zhipeng Pan
Guizhou Meiling Power Supply Co., Ltd., Zunyi 563000, China
Jianwen Chen
School of Physics and Optoelectronic Engineering, Foshan University, Foshan 528000, China
Dongxiang Luo
School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China
Rihui Yao
Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China
Jianqiu Chen
Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China
Hongfu Liang
Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China
Honglong Ning
Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China
Currently, inkjet printing conductive films have attracted more and more attention in the field of electronic device. Here, the inkjet-printed silver thin films based on nanoparticles (NP) ink and metal-organic decomposition (MOD) ink were cured by the UV curing method and heat curing method. We not only compared the electrical resistivity and adhesion strength of two types of silver films, but also studied the effect of different curing methods on silver films. The silver films based on NP ink had good adhesion strength with a lowest electrical resistivity of 3.7 × 10−8 Ω·m. However, the silver film based on MOD ink had terrible adhesion strength with a lowest electrical resistivity of 2 × 10−8 Ω·m. Furthermore, we found a simple way to improve the terrible adhesion strength of silver films based on MOD ink and tried to figure out the mechanisms. This work offers a further understanding of the different performances of two types of silver films with different curing methods.
