Energies (Apr 2024)

Numerical Investigation of Flow Boiling in Interconnected Microchannels at Varying Mass Fluxes

  • Yuanhua Li,
  • Zhanxiu Chen,
  • Cang Huhe,
  • Yao Su,
  • Hewei Xing

DOI
https://doi.org/10.3390/en17071674
Journal volume & issue
Vol. 17, no. 7
p. 1674

Abstract

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Interconnected microchannels (IMCs) in flow boiling have the advantages of optimized heat transfer performance, energy savings and high efficiency, compact size, and strong customizability. They provide new solutions for thermal management and heat transfer at the microscale and have broad application prospects. To further investigate the effect of microchannels with different numbers of transverse sections on the flow boiling heat transfer, we performed numerical simulations on a rectangular microchannel (RMC) and IMCs with 3, 5, and 7 transverse microchannels at high and low mass flux. It was found that fluid experiences similar bubble and slug flow in different numbers of IMCs and the RMC at low mass flux. At a heat flux of q = 90 W/cm2, the downstream regions of the IMCs produce vapor films that span the channels, obstructing the cross-section and weakening the flow exchange between the channels, which lead the heat transfer performance factor of IMC-3, reaching 148.43%, 110.04%, and 116.92% of the RMC, IMC-5, and IMC-7. Under high-quality flux, as the heat flux increases, the heat transfer coefficient increases and the pressure drop decreases due to the existence of lateral microchannels introduced in the interconnected microchannels. Whether at high or low mass flux, structural reasons pertaining to the RMC can easily lead to the accumulation of bubbles and the occurrence of slugs, and the flow boiling instability increases with the increase of heat flux, which leads to a pressure drop and heat transfer performance generally lower than that of IMCs under the same conditions. At q = 120 W/cm2, IMC-7 showed the best heat transfer enhancement. Its heat transfer performance factor was 129.37%, 120.594% and 107.98% of the RMC, IMC-3, and IMC-5, respectively. This article provides theoretical support for the design of interconnected microchannels in thermal management.

Keywords