BEHAVIOR OF WORK HARDENED SnPb-SOLDER AFFECTED COPPER ON CORROSION RESISTANCE IN pH VARIED ENVIRONMENTS

Abstract

Copper based materials are widely used in industrial and marine applications due to good mechanical properties and high corrosion resistant behavior. But the corrosion immunity varies for the variation of environmental factors. Moreover, alloying elements can have role on corrosion behavior, especially if it occurs through inclusion of Sn-Pb solder for repair works and environmental effects due to ageing. The present paper is an attempt to characterize the corrosion immunity level of copper after inclusion of tiny SnPb-solder material and work hardening in pH varied fresh water environments from pH1 to pH13 using gravimetric analysis, conductivity investigation and micrograph observation using optical as well as field emission scanning electronic microscope. The result reveals that solder material inclusion has increased the corrosion rate by about 14% in 30 days immersion in pH varied environments.

Keywords

• corrosion
• work hardening
• snpb-solder inclusion
• copper
• ph varied environment