Recent developments in advanced polymeric materials for solder mask application: Progress and challenges

Abstract

With the miniaturization of electronic components and higher density of electrical connections in the printed circuit boards, the properties of conventional solder masks are unfit for these ever-growing requirements, especially when subjected to extreme processing and application conditions. This has prompted the need for advanced solder mask studies. This article aims to review the structure and properties of conventional photoimageable solder masks as well as the fabrication and challenges that prompt the need for the synthesis of advanced solder mask materials. It covers an overview of the fundamentals and classification of solder masks, the topic of photoimageable solder masks and their challenges, and the related key processes that affect the solder mask properties. The synthesis of advanced solder masks with potential breakthroughs is also discussed.

Keywords

• Solder masks
• Electronic packaging
• Polymer composites
• Advanced materials
• Hyperbranched polymers