Jin'gangshi yu moliao moju gongcheng (Feb 2023)
Drilling of C/SiC composite micro holes with electroplated diamond bits
Abstract
Six kinds of diamond electroplated bits, whose diameters were 0.280~0.440 mm and the basic particle sizes of diamond were 20~30, 36~54 and 63~75 μm, were used to drill micro holes of three-dimensional needle-punched felt-based C/SiC composite materials. The optimum processing parameters of the six kinds of bits were tested, and the influences of the process parameters, the diamond basic particle size and the bit diameter on the processing quality and efficiency of micro holes were analyzed. The results show that at the same drilling speed, the lower the feed speed is, the better the micro-hole quality is. The larger the basic particle size of electroplated diamond grains on the bit is, the higher the drilling efficiency is. In the six kinds of bits, the better drilling performances can be obtained by electroplating 63~75 μm abrasive particles on 0.300 mm diameter substrate and 36~54 μm abrasive particles on 0.200 mm diameter substrate.
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