Flexible wide-range, sensitive three-axis pressure sensor array for robotic grasping feedback

Minghui Yin; Yusen Guo; Jing An; TieZhu Liu; Guangyang Gou; Tong Li; Gang Chen; Tianjun Ma; Jianhai Sun; Mengdi Han; Jianqun Cheng; Jun Zhou; Xuan Sun; Chengyu Zhuang; Haiting Li; Chunxiu Liu; Zhimei Qi; Ning Xue

Sensors and Actuators Reports (Dec 2024)

Flexible wide-range, sensitive three-axis pressure sensor array for robotic grasping feedback

Minghui Yin,
Yusen Guo,
Jing An,
TieZhu Liu,
Guangyang Gou,
Tong Li,
Gang Chen,
Tianjun Ma,
Jianhai Sun,
Mengdi Han,
Jianqun Cheng,
Jun Zhou,
Xuan Sun,
Chengyu Zhuang,
Haiting Li,
Chunxiu Liu,
Zhimei Qi,
Ning Xue

Affiliations

Minghui Yin: State Key Laboratory of Transducer Technology, Aerospace Information Research Institute (AIR), Chinese Academy of Sciences, Beijing 100094, PR China; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, PR China
Yusen Guo: State Key Laboratory of Transducer Technology, Aerospace Information Research Institute (AIR), Chinese Academy of Sciences, Beijing 100094, PR China; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, PR China
Jing An: Beijing University of Posts and Telecommunications, Beijing 100876, PR China
TieZhu Liu: State Key Laboratory of Transducer Technology, Aerospace Information Research Institute (AIR), Chinese Academy of Sciences, Beijing 100094, PR China; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, PR China
Guangyang Gou: State Key Laboratory of Transducer Technology, Aerospace Information Research Institute (AIR), Chinese Academy of Sciences, Beijing 100094, PR China; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, PR China
Tong Li: Beijing University of Posts and Telecommunications, Beijing 100876, PR China
Gang Chen: Beijing University of Posts and Telecommunications, Beijing 100876, PR China
Tianjun Ma: School of Integrated Circuit, Quanzhou University of Information Engineering, Quanzhou, Fujian 362000, PR China
Jianhai Sun: State Key Laboratory of Transducer Technology, Aerospace Information Research Institute (AIR), Chinese Academy of Sciences, Beijing 100094, PR China; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, PR China
Mengdi Han: Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100091, PR China
Jianqun Cheng: Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100091, PR China
Jun Zhou: School of Information and Communication Engineering, University of Electronic Science and Technology of China, Chengdu 611731, PR China
Xuan Sun: Department of Neurology, Beijing Tiantan Hospital, Capital Medical University, Beijing, 100070, PR China
Chengyu Zhuang: Department of Orthopaedics, Shanghai Key Laboratory for Prevention and Treatment of Bone and Joint Diseases, Shanghai Institute of Traumatology and Orthopaedics, Ruijin Hospital, Shanghai Jiao Tong University School of Medicine, Shanghai, 200025, PR China
Haiting Li: School of Information and Communication Engineering, University of Electronic Science and Technology of China, Chengdu 611731, PR China
Chunxiu Liu: State Key Laboratory of Transducer Technology, Aerospace Information Research Institute (AIR), Chinese Academy of Sciences, Beijing 100094, PR China; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, PR China; Corresponding authors.
Zhimei Qi: State Key Laboratory of Transducer Technology, Aerospace Information Research Institute (AIR), Chinese Academy of Sciences, Beijing 100094, PR China; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, PR China; Corresponding authors.
Ning Xue: Lingang Laboratory, Shanghai 200031, PR China; Corresponding authors.

Journal volume & issue: Vol. 8
p. 100250

Abstract

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Flexible pressure sensors capable of detecting normal and tangential forces through physical contact have garnered considerable interest in the realm of human-interactive systems. However, simultaneous detection of multi-directional forces is still a challenge for current research. Herein, a capacitive flexible pressure sensor based on a sandwich structure for three-dimensional force detection is proposed. The fabrication process of the sensor array is straightforward, capable of effectively distinguishing between normal and tangential forces. Polyimide (PI) serves as the flexible substrate for depositing the metal electrode pattern, while Polydimethylsiloxane (PDMS) acts as the intermediate dielectric layer material and the three-dimensional force conduction block. Through a comparative study of the thickness of the hollow dielectric layer, a pressure sensor with superior performance was prepared, featuring high sensitivity across a wide working range. Test results demonstrate its capability to detect normal forces ranging from 0 to 46 N (0–520 kPa) with a sensitivity of 0.442 N−1 (0.031 kPa−1) and tangential forces from 0 to 10 N with a sensitivity of 0.08 N−1 (X-axis) and 0.07 N−1 (Y-axis). The designed acquisition system can simultaneously gather data from 6 sensor arrays, totaling 240 channels, with a response time of 11 ms. This sensor array, characterized by flexibility, versatility, and a wide range, is suitable for applications in robot tactile perception.

Published in Sensors and Actuators Reports

ISSN: 2666-0539 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Science: Mathematics: Instruments and machines
Website: https://www.journals.elsevier.com/sensors-and-actuators-reports/

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