Hybrid structural electronics printing by novel dry film stereolithography and laser induced forward transfer

Abstract

Abstract 3D printing has seen much progress in recent decades with the introduction of new materials and printing techniques. This article describes the combination of a novel, stereolithography (SLA) based method for structural material buildup with laser induced forward transfer (LIFT) printing of conductive and resistive elements and placement of commercial active and passive components for the additive manufacturing of 3D functional electronic devices. The structural material is composed of dry film photoresists that are exposed and laminated to form a stack which is later developed to remove unexposed area and reveal the desired free form shape. Interconnection using pillar penetration between the structural layers is described in detail. Several examples of functional objects (lamp, microphone) demonstrate the practicality of this novel, multi material printing method.

Keywords

• digital light processing
• high throughput printing
• hybrid printing
• laser induced forward transfer
• photo sensitive dry films