MEMS Device for Quantitative In Situ Mechanical Testing in Electron Microscope
Xiaodong Wang,
Shengcheng Mao,
Jianfei Zhang,
Zhipeng Li,
Qingsong Deng,
Jin Ning,
Xudong Yang,
Li Wang,
Yuan Ji,
Xiaochen Li,
Yinong Liu,
Ze Zhang,
Xiaodong Han
Affiliations
Xiaodong Wang
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
Shengcheng Mao
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
Jianfei Zhang
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
Zhipeng Li
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
Qingsong Deng
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
Jin Ning
Research Center of Engineering for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
Xudong Yang
College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
Li Wang
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
Yuan Ji
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
Xiaochen Li
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
Yinong Liu
School of Mechanical and Chemical Engineering, The University of Western Australia, Crawley 6009, WA, Australia
Ze Zhang
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
Xiaodong Han
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China
In this work, we designed a micro-electromechanical systems (MEMS) device that allows simultaneous direct measurement of mechanical properties during deformation under external stress and characterization of the evolution of nanomaterial microstructure within a transmission electron microscope. This MEMS device makes it easy to establish the correlation between microstructure and mechanical properties of nanomaterials. The device uses piezoresistive sensors to measure the force and displacement of nanomaterials qualitatively, e.g., in wire and thin plate forms. The device has a theoretical displacement resolution of 0.19 nm and a force resolution of 2.1 μN. The device has a theoretical displacement range limit of 5.47 μm and a load range limit of 55.0 mN.
