Silica is one of the most efficient gas barrier materials, and hence is widely used as an encapsulating material for electronic devices. In general, the processing of silica is carried out at high temperatures, i.e., around 1000 °C. Recently, processing of silica has been carried out from a polymer called Perhydropolysilazane (PHPS). The PHPS reacts with environmental moisture or oxygen and yields pure silica. This material has attracted many researchers and has been widely used in many applications such as encapsulation of organic light-emitting diodes (OLED) displays, semiconductor industries, and organic solar cells. In this paper, we have demonstrated the process optimization of the conversion of the PHPS into silica in terms of curing methods as well as curing the environment. Various curing methods including exposure to dry heat, damp heat, deep UV, and their combination under different environments were used to cure PHPS. FTIR analysis suggested that the quickest conversion method is the irradiation of PHPS with deep UV and simultaneous heating at 100 °C. Curing with this method yields a water permeation rate of 10−3 g/(m2⋅day) and oxygen permeation rate of less than 10−1 cm3/(m2·day·bar). Rapid curing at low-temperature processing along with barrier properties makes PHPS an ideal encapsulating material for organic solar cell devices and a variety of similar applications.
