PCB plug-in solder joint defect detection method based on coordinated attention-guided information fusion

Abstract

Abstract Printed Circuit Boards (PCBs) are the foundational component of electronic devices, and the detection of PCB defects is essential for ensuring the quality control of electronic products. Aiming at the problem that the existing PCB plug-in solder defect detection algorithms cannot meet the requirements of high precision, low false alarm rate, and high speed at the same time, this paper proposes a method based on spatial convolution pooling and information fusion. Firstly, on the basis of YOLOv3, an attention-guided pyramid structure is used to fuse context information, and multiple convolutions of different size are used to explore richer high-level semantic information; Secondly, a coordinated attention network structure is introduced to calibrate the fused pyramidal feature information, highlighting the important feature channels, and reducing the adverse impact of redundant parameters generated by feature fusion; Finally, the ASPP (Atrous Spatial Pyramid Pooling) structure is implemented in the original Darknet53 backbone feature extraction network to acquire multi-scale feature information of the detection targets. With these improvements, the average detection accuracy of the enhanced network has been elevated from 94.45 to 96.43%. This experiments shows that the improved network is more suitable for PCB plug-in solder defect detection applications.

Keywords

• PCB plug-in solder joint defect detection
• YOLOv3
• Void space convolution pooling
• Feature information fusion