Temperature field analysis and compensation improvement of load cell

Abstract

Abstract During the operation of load cell, heat is generated by the strain gauge and the electronics on the PCB board, which leads to temperature gradients within the sensor itself. These temperature gradients are unstable at different ambient temperatures. Compensation inaccuracies can also occur when compensating for sensor measurements at different temperatures This paper proposes a method to change the position of temperature compensation resistors to address errors caused by the temperature field effect of the strain gauge sensor itself. Without affecting the sensor’s strain measurement, the correctness of the proposed method is demonstrated through steady-state thermal simulation results in ANSYS and experimental results, effectively addressing errors caused by unstable temperature gradients during the operation of strain gauge sensors.

Keywords

• Load cell
• Temperature gradient
• Temperature compensation
• Compensation resistance
• Thermal simulation