A Novel Noise Reduction Approach of Acoustic Emission (AE) Signals in the SiC Lapping Process on Fixed Abrasive Pads
Jie Lin,
Jiapeng Chen,
Wenkun Lin,
Anjie He,
Xiaodong Hao,
Zhenlin Jiang,
Wenjun Wang,
Baoxiu Wang,
Kerong Wang,
Ying Wei,
Tao Sun
Affiliations
Jie Lin
Research Center for Advanced Micro-/Nano-Fabrication Materials, School of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Jiapeng Chen
Research Center for Advanced Micro-/Nano-Fabrication Materials, School of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Wenkun Lin
Research Center for Advanced Micro-/Nano-Fabrication Materials, School of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Anjie He
Research Center for Advanced Micro-/Nano-Fabrication Materials, School of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Xiaodong Hao
Research Center for Advanced Micro-/Nano-Fabrication Materials, School of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Zhenlin Jiang
Research Center for Advanced Micro-/Nano-Fabrication Materials, School of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Wenjun Wang
Research Center for Advanced Micro-/Nano-Fabrication Materials, School of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Baoxiu Wang
Research Center for Advanced Micro-/Nano-Fabrication Materials, School of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Kerong Wang
Jiangsu Key Laboratory of Precision and Micro-Manufacturing Technology, National Key Laboratory of Science and Technology on Helicopter Transmission, College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
Ying Wei
Zhengzhou Abrasive Grinding Research Institute Co., Ltd., State Key Laboratory for High Performance Tools, Zhengzhou 450001, China
Tao Sun
Research Center for Advanced Micro-/Nano-Fabrication Materials, School of Chemistry and Chemical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Acoustic emission (AE) technology has been widely utilized to monitor the SiC wafer lapping process. The root-mean-square (RMS) of the time–domain eigenvalues of the AE signal has a linear relationship with the material removal rate (MRR). However, the existence of background noise severely reduces signal monitoring accuracy. Noise interference often leads to increased RMS deviation and signal distortion. In the study presented in this manuscript, a frequency threshold noise reduction approach was developed by combining and improving wavelet packet noise reduction and spectral subtraction noise reduction techniques. Three groups of SiC lapping experiments were conducted on a fixed abrasive pad, and the lapping acoustic signals were processed using three different noise reduction approaches: frequency threshold, wavelet packet, and spectral subtraction. The results show that the noise reduction method using the frequency threshold is the most effective, with the best coefficient of determination (R2) for the linear fit of the RMS to the MRR.
