Journal of Materials Research and Technology (Nov 2020)

Theoretical modelling of brittle-to-ductile transition load of KDP crystals on (001) plane during nanoindentation and nanoscratch tests

  • Chen Li,
  • Yong Zhang,
  • Guangzhe Zhou,
  • Zongjie Wei,
  • Liangchi Zhang

Journal volume & issue
Vol. 9, no. 6
pp. 14142 – 14157

Abstract

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KDP single crystals are widely used in inertial confinement fusion and high power lasers due to the wide transmission band, high laser damage threshold, large nonlinear optical coefficient, etc. However, surface and subsurface damages are easily induced into the KDP crystal components during the machining process due to its high brittleness and distinct anisotropy. These damages will reduce the service accuracy and life of KDP crystal components. It is of great significance to study the brittle-to-ductile transition of KDP crystals to achieve high efficiency and precision machining of crystal components. In this work, a theoretical model of brittle-to-ductile transition load during the nanoindentation and nanoscratch processes of KDP crystals was established based on the energy conservation law and dislocation theory. This model took the anisotropy of KDP crystals into account. Nanoindentation and nanoscratch experiments by using different indenters were performed to verify the theoretical model of brittle-to-ductile transition load. The experimental results of the brittle-to-ductile transition load agreed well with the theoretical results, which indicated that the model was reliable. Both experimental and theoretical results showed that the critical load of brittle-to-ductile transition during the nanoindentation and nanoscratch processes increased as the half cone angle increased. In addition, the critical load of brittle-to-ductile transition load of the scratch was lower than that of the indentation under the same condition. The results also demonstrated that KDP crystals had distinct anisotropy during the nanoindentation and nanoscratch process. Brittle fracture was most likely to occur along [100] orientation during the scratch process. Under the same scratching condition, [110] orientation was prone to achieving ductile machining with high surface quality compared with other orientations.

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